Copper foil tape is considered in electrical contact and shielding-related assemblies where the conductive path must be understood. ETI can review the overlap, substrate and contact arrangement before a grade is selected. Conductivity through the adhesive is a separate property to verify; the presence of a copper backing alone does not confirm it.
Shielding interface enquiries
Conductive contact trials
Cable and enclosure applications
Adhesive conductivity requirement, resistance target, joint layout, substrate and tape width. Share the details you know; our team can help with the rest.
Share with your purchasing or technical team
Tell us your application, dimensions and quantity. Our team can review your enquiry.